Changdian Technology gub Oriental Fortune Network

The performance of changdian science and technology continued to grow. With the new high-end sealing and testing capacity put into production one after another, the company's performance will reach a new level, and the outbreak of leading performance is just around the corner. Packaging testing is an asset-heavy industry with high investment threshold. Changdian has been deeply involved in the industry for many years, and its customers are outstanding in all fields. The release of high-end packaging and testing capabilities will push Changdian to a new level. The financing balance of Changdian Technology is 1, 1595 15285 yuan, the balance of securities lending is 3.424 million yuan, the financing purchase amount is 402 17784 yuan, the financing repayment amount is 66,956,055 yuan, and the financing purchase amount is net.

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Introduction of Changdian Technology (600584);

1. The full name of Changdian Technology Company is Jiangsu Changdian Technology Co., Ltd., located in Jiangyin City, Jiangsu Province. Established in 1998 1 1.6, and listed on June 3, 2003. Its predecessor was Jiangyin Transistor Factory, which was born in 1.972. Up to now, the registered capital is 654.38+06 billion, and the National Integrated Circuit Industry Investment Fund Co., Ltd. is the largest shareholder.

2.1998165438+16 October, the company was established as Jiangyin Changjiang Electronics Industry Co., Ltd., and the promoters were Xinchao Technology, Shanghai Huayi, Shanghai Hengtong, slane Microelectronics, Jiangyin Changjiang Electronics, Xiamen Yonghong Electronics, Ningbo Kangqiang Electronics and Lianyungang Huawei Electronics, who were engaged in packaging and testing of discrete devices and integrated circuits.

3. In April 2009, the holding subsidiary of Changdian Technology acquired the 5 1% equity of Singapore JC Investment Pte Ltd. for RMB165 million, and indirectly held the 26.0 1% equity of Singapore APS Investment Pte Ltd. is a high-tech company specializing in the research and development of integrated circuit packaging technology, providing services for major semiconductor companies and electronic devices. The company has a number of patented technologies registered in the United States, Japan, Taiwan Province Province and Chinese mainland, all of which are at the international leading level.

4. Huajin Semiconductor was established to integrate and accelerate the development of integrated circuit packaging and testing technology in China, recruit talents through three channels, attract wisdom, form a joint force, and enhance the technical level and market position of semiconductor packaging and testing in China.

5. Packaging technology and mass production capacity lead the industry. Changdian Technology keeps pace with international advanced counterparts in high-end packaging technologies (such as fan-out eWLB, WLCSP, SiP, BUMP, PoP, etc.). ), and in the leading level in China, and has achieved mass production.