Why is the salary of silicon wafer cutting high?

This kind of chip made of silicon wafer is called "magic operator" and has amazing computing power. No matter how complicated the mathematical problems, physical problems and engineering problems are, no matter how heavy the calculation workload is, the computer can tell you the answer in a short time as long as the staff tells it the problem through the computer keyboard and sends out ideas and instructions to solve the problem.

So it takes years or decades for manual calculation, and the computer can solve it in a few minutes. Even some questions that humans can't figure out, computers can tell you the answers quickly.

Technology:

Producers must balance these related factors to maximize productivity. Higher cutting speed and greater load will increase the tension of the cutting line and increase the risk of cutting line breakage. Since all silicon wafers on the same block are cut at the same time, if one of the cutting lines breaks, all partially cut silicon wafers must be discarded.

However, it is not advisable to use thicker and stronger cutting lines, which will reduce the number of silicon wafers produced by each cutting and increase the consumption of silicon materials.

Wafer thickness is also a factor in productivity because it is related to the number of wafers produced per wafer block. Ultra-thin silicon wafers pose additional challenges to wire saw technology because the production process is more difficult. In addition to the mechanical brittleness of the wafer, if the wire saw process is not well controlled, fine cracks and bending will have a negative impact on the yield of the product. The ultra-thin slicing wire saw system must be able to accurately control the process linearity, cutting linear speed and pressure, and cutting coolant.