What are the responsibilities of "semiconductor discrete device and integrated circuit assembler"?

(1) Divide the wafer into chips by dicing machine and sintering furnace, sinter the chips to the core, lead frame or designated position, and connect the internal and external electrodes;

(2) sealing the assembled chip or substrate in a plastic package or tube shell by using packaging equipment;

(3) Using test equipment and tools to assemble thick film circuits, sensors, microwave circuits and optical fiber hybrid integrated circuits and debug them;

(4) sintering the wafer, the doping material and the ohmic material in a high-temperature furnace to form a PN junction or ohmic level;

(5) using equipment and tools to prepare crystals and contact wires, and assembling and adjusting point contact diodes;

(6) The semi-finished products and finished products of semiconductor discrete devices, integrated circuits and hybrid integrated circuits are aged and screened by using test equipment.

The following types of jobs belong to this occupation:

Chip assembler, packager, hybrid integrated circuit assembler, point contact diode manufacturer, alloy sintering worker, semiconductor thermoelectric refrigeration component manufacturer, semiconductor thermoelectric refrigeration component manufacturer.