How to use the proportion of copper plating additive No.1 and No.2 in gravure plate making?

1. Preparation of electrolyte containing No.1 and No.2 additives: According to the total amount of electrolyte needed, mix No.1 and No.2 additives according to the volume ratio of 1: 1.

2. Pretreatment of copper plate: cleaning, degreasing, derusting, etc.

3. Immerse the copper plate in the electrolyte: put the copper plate into the prepared electrolyte, and pay attention to ensure that the copper plate is completely immersed in the liquid to avoid the uneven copper layer caused by the high local current density.

4. electrifying copper plating: the copper plate is electrified with a constant current density in the electrolyte, so that copper atoms are precipitated on the electrode surface, and finally a thin copper layer is formed on the surface of the copper plate.

5. Wash the copper plate: After taking out the copper plate, wash it under running water to remove electrolyte and residual additives.

6. drying the copper plate: drying or baking the copper plate, and carrying out the subsequent plate-making process.