Products of Changsha Dale New Material Technology Co., Ltd.

Electroplated diamond wire is a kind of fixed abrasive wire, which is based on the two-body wear cutting principle between the abrasive fixed on the steel wire and the workpiece material. Abrasive particles will not directly act on the saw line, which is a rigid cutting method and greatly improves the cutting efficiency. The invention can conveniently use low-viscosity cooling lubricating liquid, and the cooling liquid only contains chips, so that the recycling of chips is easier, and the effects of high efficiency, energy saving and environmental protection are obvious. There are two kinds of bonded abrasive wires: resin bonded diamond wire and electroplated diamond wire. The application of resin bonded diamond beads is limited due to the high heat generated in high-speed cutting process and the low temperature resistance of resin. Electroplated diamond wire is considered as the most promising high-tech diamond product for solar polysilicon cutting.

1, product specifications: serial number product line diameter (mm) line diameter deviation (mm) breaking force (n) The main uses of the product are 1 0. 12 0.005 ≥30 silicon wafers 2 0. 14 0.005 ≥40 silicon wafers 30.260. .030 ≥ 65438, silicon root 5 0.34 (corrugated) 0.030 ≥ 150, silicon root 6 0.35 0.030 ≥ 160, silicon root 7 0.37 0.030 ≥ 190, and product 2.

B, high tensile strength: the strength of electroplated diamond wire is more than 1 10% of the original blank wire strength. The technical problem of embrittlement of electroplating line caused by tensile stress induced by electroplating was successfully solved, and the wire breakage rate during cutting was lower than that of similar products.

C, strong cutting ability and good surface quality: realize uniform distribution of diamond micropowder particles, controllable density, no agglomeration, uniform wire diameter of electroplated diamond, strong cutting ability and good surface quality.

D. Compared with the traditional cutting method, the cutting cost of electroplated diamond wire saw is lower and the efficiency is higher: the total running cost is reduced by 30%, the cutting speed is 2.8 times that of the traditional cutting method, and only half of the original floor space is needed to achieve the same production capacity.

E, provide a cleaner and more convenient production environment: because mortar is not needed, the design of SiC/PEG is omitted, the generation of waste is reduced, and the cost of waste treatment is reduced. Make the production environment cleaner and easily meet the requirements of downstream high-end customers for environmental protection.