What does Samsung Semiconductor PKG technical engineer do?

PKG is the abbreviation of package, that is, packaging. The position of Samsung Semiconductor is a packaging technical engineer. Its main responsibility is to complete the control of product packaging testing process.

Specific responsibilities can refer to the following requirements, which are the recruitment conditions of Samsung's latest foundry in Xi 'an:

Leaf project:

-By analyzing the causes and improving the definition

-Reduce costs by increasing production.

Molding:

-Improve quality, output management and reduce material costs.

-Stabilize the new salary package and deduction problem as soon as possible,

-Make countermeasures before mass production.

-Skills upgrading is to ensure basic and core technologies.

Chip mounting process engineering (chip mounting process engineering)

-Provide technical solutions for various customer-specific applications.

-Develop and optimize the mold installation process.

-Existing and new equipment connecting film (DAF) for quality assurance molds.

Wire bonding process engineering (wire bonding process engineering)

-Provide customers with technical solutions for various customer-specific applications.

-Develop and optimize bonding process.

-Quality assurance of existing and new capillary equipment, including gold wire and silver wire.

Solder ball attachment technology

-Solder ball bonding is the process of connecting solder balls to PCB solder ball pads with flux. It is made of tee joint, reflow soldering and cleaning.

-Understand the machine function, operation, parameters and basic materials.