Brief introduction of Tongling Fengshan Sanjia microelectronics Co., Ltd.

Tongling Fengshan Sanjia Microelectronics Co., Ltd. was established on 200 1, which was jointly funded by Tongling Sanjia Electronics (Group) Co., Ltd. and Korea Fengshan Microelectronics Co., Ltd. This project mainly adopts the advanced lead frame manufacturing technology of Toyama Microelectronics in Korea, and introduces 16 stamping production line made in Germany and Japan and 9 electroplating production lines made in Korea. Through years of development, it integrates the design, processing, assembly and debugging of high-speed stamping die, as well as the ability to manage equipment such as cutting and punching, and makes it by itself.