Which jobs are good for pcb manufacturers?

in the positions of p>pcb production enterprises, the processes of copper immersion, electroplating, printing and welding prevention, characters and other positions will be relatively tired, and the inspection process will be relatively easy. IT-8 chemical tin ImmersionTinProcess is a kind of pad surface treatment process specially designed to replace hotairsolderleveling on PCB. IT-8 deposits bright white lead-free tin immersion coating on copper surface and has the following characteristics: 1) ExcellentSolderability. 2) Finergrainstructure, very dense. 3) No sediment, easy maintenance. 4) The surface solderability can be maintained for 12 months. 5) It is suitable for SMT assembly and can pass the assembly requirements of IRreflow for three times. 6) FinePitchTechnology suitable for thin lines. 7) Whiskered beard phenomenon in Wuxi. 8) The deposition rate will not slow down sharply with the increase of copper content. 9) Lead-free coating meets the requirements of RoHS and WEEE. Manufacturing process--------------------------------. At 45℃, 5 minutes, double water washing, 1 minute, micro-etching degreasing agent ME-285% (V/V) at 25℃, 1 minute, double water washing, .5 minute, pure water washing, .5 minute, copper surface conditioner CC-325% (V/V) at 3℃, .5 minute, pre-tinning IT-8m, 1% (V/V) at 3℃, 1 minute, chemical tin IT. Hot double pure water washing at 25℃ for 2 seconds at 5℃ for 1 minute to blow dry the acid cleaner AC-1 for chemical tin process is a sulfuric acid acid acid cleaner developed for fine lines and small-aperture high-density wiring boards, which uses special surfactants, has good water washing performance, has good cleaning power, does not attack the solder resist ink on the circuit board, can effectively remove copper surface oxidation, and has cleaning and activating effects on the surface of copper lines. Micro-etching degreaser-ME-2 micro-etching degreaser has stable biting speed, can effectively and thoroughly remove all kinds of stains, and the treated copper surface has slight oxidation resistance, so that the copper substrate of the circuit board will not be oxidized again before the subsequent process. CC-3, a copper surface conditioner, is a special copper surface activating agent before electroless tin pre-plating, which can effectively and thoroughly remove the residue of micro-etching degreasing agent, and the appearance of electroless tin is more uniform and beautiful, which can effectively reduce the number of copper and tin crystals in electroless tin layer. Electroless tin IT-8 is suitable for forming a white and dense pure tin coating with a thickness of about .6-1.5 microns on the bare copper surface of rigid printed circuit boards through chemical displacement reaction. The solution can be used for both horizontal production line and vertical line. Post-immersion agent PRA-4 is a special treatment drug for semi-plug hole printed circuit board after chemical tin immersion and before water washing. It can effectively remove the residue of chemical tin solution in semi-plug hole and prevent appearance problems caused by poor water washing. PRA-4 is a highly concentrated liquid-it does not contain any heavy metals or harmful substances.