What is the difference and connection between wire bonding debugging and chip bonding debugging?

Introduction of LED packaging technology

Crystal expansion: open the densely arranged wafers a little to facilitate crystal fixation.

2. Die fixing: Apply conductive/non-conductive adhesive to the bottom point of the bracket (whether it is conductive or not depends on whether the wafer is upper and lower PN junction or left and right PN junction) and then put the wafer into the bracket.

3. Short baking: Keep the wafer still when the glue cures the bonding wire.

4. Bonding: Connect the wafer and the bracket with gold wire.

5. Pre-test: Can the initial test be bright?

6. Glue pouring: Wrap the chip and bracket with glue.

7. Long baking: Let the glue solidify.

8. Post-test: test whether it can be lit and whether the electrical parameters are up to standard.

9. Spectral separation separates products with roughly the same color and voltage.

10. packaging.