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How to improve the tension of silver plating in the process of integrated circuit electroplating
Use silver plating, etc.
1. Choosing a suitable substrate for silver plating is also the key to improve tension. The substrate used is copper or silver, which has good electrical conductivity and reliable mechanical properties.
2. In the process of silver plating, controlling the technological parameters of silver plating will also affect the tension of silver plating layer, including the formula of silver plating solution, temperature, current density and silver plating time.
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