Which is better for smt chip processing?

Smt chip processing belongs to Shenzhen Jingbang Electronics Co., Ltd. and Shijiazhuang Zerun Technology Co., Ltd..

Shenzhen Jingbang Electronics Co., Ltd. is a state-owned enterprise specializing in PCB and PCBA manufacturing for 20 years. The company has a group of powerful engineering teams and electronic component purchasing teams accumulated for more than ten years. It is a one-stop integrated manufacturing service provider integrating PCB manufacturing, electronic component replacement, SMT chip processing, testing and assembly, a national high-tech enterprise in 20 18 electronic processing industry and a high-tech enterprise in Shenzhen.

Shijiazhuang Zerun Technology Co., Ltd. is a high-tech enterprise integrating R&D, design, production and sales, focusing on the whole process of design review, process improvement, material matching, material procurement, surface mount welding, wave soldering, product assembly, debugging, testing, three-proof spraying, high and low temperature environment experiment and aging of electronic information products.

Selection of smt patch

The selection and design of surface mount components is the key link in the overall design of products. Designers should determine the electrical performance and function of components in the stage of system structure and detailed circuit design. In the stage of SMT design, the packaging form and structure of surface mount components should be determined according to the specific conditions of equipment and technology and the overall design requirements.

Surface mount solder joints are both mechanical and electrical connections. Reasonable selection has a decisive influence on improving PCB design density, productivity, testability and reliability. There is no difference in function between surface-mounted components and plug-ins, but the difference lies in the packaging of components. During the welding process, the components and substrates of surface mount package that withstand high temperature must have matching thermal expansion coefficients, and these factors must be considered comprehensively in product design.