Brief introduction of Suzhou Delong laser co., ltd.

I. Infrared laser (wavelength 1064 nm)

1. thin film solar energy P 1 layer etching.

2. Laser marking

3. Cutting and scribing

4. Thermal printing

5. Fully automatic laser resistance adjustment

6. Scientific research, etc

Second, the green laser (wavelength 532nm)

1. solar etching of thin films

2. Wafer cutting

3. Marking of glass and ceramics

4. Cutting and scribing

5. Micropore processing

6.PCB drilling

Three, ultraviolet laser (wavelength 355nm)

1. solar etching of thin films

2. Wafer cutting

3. Marking of glass, ceramics and plastics

4. Cutting and scribing

5. Micropore processing

6.FPC cut a sentence. Picosecond laser cutting equipment soft scanning gun

1. Processing capacity: 19pcs/h@ 10×23mil (monthly processing capacity exceeds 10000 pieces).

2. The brightness after cutting is 5~ 10% higher than that of traditional laser dicing (packaged brightness).

3. The processing yield is 3-5% higher than that of the sidewall etching process, and the chip performance consistency is good.

4. The wavelength of standard laser source is 1064nm, which can directly cut the back cross DBR chip.

5. Chips with thickness less than 200μm can be directly cut together.

The second is Ultra dicing machine, which is a kind of equipment that uses ultraviolet laser to dice LED wafers at high speed.

1. Unique V-shaped notch can help your chip easily achieve satisfactory brightness improvement.

2. Fast speed and high productivity

3. Standard 4-inch platform, leaving enough room for upgrade.

4. Automatic image recognition and positioning system, so that recognition and positioning can be completed with one key.

Third, the light guide plate laser dot pattern system laser dot pattern system ink printing dot laser dot efficiency is 2min/pc (first line) 5- 10min/pc(55 ") consumables ink, water, electricity, gas, screen, acid electricity supporting equipment, transmission line, oven, etc. There is no design cycle (long screen production time), short manpower, 1~2 people, complex and simple operation, high rejection rate (ink is easy to fall off), low factory occupation of 200m2/4m2 per line/high processing quality (brightness) of each equipment. ITO laser etching equipment ITO laser etching system Laser DPSS 1064nm/355nm Working width 400mm×500mm (customizable) Processing speed Linear 1000mm/s (maximum) and Curve 3000mm/ S (maximum) Processing linewidth 10~50μm Comprehensive processing.

1. Machinable materials such as stainless steel and alloy.

2. Ceramic materials such as alumina and aluminum nitride can be treated.

3. High-speed wire cutting of ceramics

4. Cutting and processing the battery pole piece.

5. Drilling and cutting of thin metal parts