At present, what are the schools offering smt major in domestic universities?

Microelectronics manufacturing engineering is a characteristic specialty outside the professional catalogue approved by the State Education Commission, and our school is the first engineering college in China to offer this specialty. This major trains senior engineering and technical personnel with basic theories and skills such as microelectronic assembly and packaging automation system design, surface assembly process design, product design, system inspection, equipment operation and maintenance, integrated circuit principle and manufacturing technology, microelectronic component manufacturing equipment and technology, and can engage in scientific research, development, production, teaching and other work in microelectronic manufacturing related units. From the end of 1990s to the beginning of this century, with the shift of the focus of the international electronic manufacturing industry to Southeast Asia, China coastal areas and the mainland, the electronic manufacturing industry has gradually become one of the pillar industries in China, and the demand for microelectronic assembly and packaging talents has increased rapidly. Many well-known enterprises and scientific research institutions at home and abroad specially come to our school to recruit undergraduate and master graduates related to this, and give us a large number of experimental equipment and advanced production lines, establish professional laboratories, and cooperate in scientific research and development and personnel training, so that our school enjoys a high reputation in the industry. This major has graduated from many masters, and has a district-level key laboratory for microelectronic surface assembly.

Main courses: engineering mechanics, principle and design of precision machinery, electronics and electrician technology, semiconductor physics, modern control engineering, microelectronic manufacturing technology and equipment, microelectronic assembly technology, SMT technology and design, principle and application of SMT equipment, computer numerical control technology, microelectronic packaging and packaging test technology, etc.

Main professional experiments: surface mount solder paste printing experiment, surface mount chip experiment, chip interconnection bonding experiment, surface mount component repair experiment, assembly quality detection and control experiment, packaging material performance test and packaging reliability test.